Product/Service

Integrated Metrology Tools for Opaque and Transparent Films

Source: Rudolph Technologies
The i-MP tool for opaque films and the i-SL for transparent films incorporate measurement technologies in a compact design that is an add-on to the process tool with minimal impact on footprint
Rudolph Technologies tool for opaque films and the i-SL for transparent films incorporate measurement technologies in a compact design that is an add-on to the process tool with minimal impact on footprint. They are used in conjunction with the company's stand-alone tools to characterize process problems and excursions.

Rudolph Technologies extends PULSE ultrasonic metal film thickness metrology to multiple metal film processes in a compact design. The new tool can be ntegrated with tools used in CMP, CVD, and ECD.

The i-SL extends laser spectroscopic ellipsometry to real-time integrated transparent film thickness metrology for multiple processes. It uses stable, intense laser light sources to give the most repeatable t, n, and k measurements for transparent film semiconductor process control.

Software for both integrated tools automatically flags out-of-spec wafers based on real-time multi-point measurements.

<%=company%>, One Rudolph Road, Flanders, NJ 07836, Tel: 973-691-1300, Fax: 973-691-5480